Digital Image Correlation (DIC) technology provides three-dimensional measurements of shape, global displacement and relative displacement (strain) on the surface an object using an optical method.
Generally, DIC systems involve two or more imaging sensors (cameras) to provide sufficient information to for the software to triangulate and track objects in three dimensions.
With the help of a randomized speckle pattern applied to the object’s surface, DIC systems can resolve displacements into continuous stress and strain measurements within the area of focus.
Some of the main advantages of DIC systems include:
- Suitable for small- and large-scale objects
- Capable of extremely wide, adaptable measurement range
- Provides remote data acquisition where manual measurements are not practical
- Suitable for complex geometries and structures
- Generates detailed, continuous data sets
From resolving the changes in wire-wrapped screen gap widths during thermal cycle testing to measuring the critical stresses on a lateral access junction, or even monitoring crack propagation on carbon-fiber wing panels, C-FER’s DIC application experts can assist with a variety of challenging applications.